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Low temperature solder solutions have been gaining interest in recent years as a technology enabler for next generation chip-scale package designs. Recent alloying advancements led to the development of the HRL3 alloy that significantly improves reliability over traditional tin-bismuth (SnBi)-based low temperature solder alloys. Learn more.
Develop understanding of distinct differences between traditional SnBi solders and next generation low temperature solders such as HRL1
Compare drop shock and thermal cycling data for HRL3 to baseline surface-mount technology (SMT) alloys such as SAC305
Detail the effect low temperature solders have on warpage induced defects such as non-wet open (NWO) or head-in-pillow (HIP)
Learn how low temperature solders have to potential to enable next generation package designs